Samsung Electronics has showcased its latest advancement, the processing-in-memory (PIM) technology. The company further revealed that the first successful integration of its PIM-enabled High Bandwidth Memory (HBM-PIM) with the Xilinx Virtex Ultrascale+ (Alveo) AI accelerator system was found to boost the overall system performance whilst reducing energy consumption by more than 60 per cent.
“HBM-PIM is the industry’s first AI-tailored memory solution being tested in customer AI-accelerator systems, demonstrating tremendous commercial potential,” Nam Sung Kim, senior vice president of DRAM Product and Technology at Samsung Electronics, said. “Through standardisation of the technology, applications will become numerous expanding into HBM3 for next-generation supercomputers and AI applications, and even into memory modules used in data centres.”
“SAP has been continuously collaborating with Samsung on their new and emerging memory technologies to deliver optimal performance and help database acceleration,” Oliver Rebholz, head of HANA core research and innovation at SAP, said. “Based on performance projections and potential integration scenarios, we expect significant performance improvements and higher energy efficiency for data centres.”
