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Husam Alissa

Director Advanced Thermal and Performance

Microsoft

Husam Alissa is a Director of Advanced Cooling & Performance in Microsoft’s Cloud Operation & Innovation, Advanced Development Team. His focus areas include systems (chip-server-datacenter), cooling (air, direct to chip, immersion, and cryogenics), performance, architecture, reliability, efficiency, sustainability, and TCO, with more than fifty publications in these fields and multiple patents. His work has received many recognitions including DCD Award for Mission Critical Tech Innovation, IEEE Micro Top Picks, NewYork State Assembly Early Career Achievement, IEEE TCPMT Best Paper Award, ASME InterPACK Outstanding Paper Award, and S3IP Distinguished Doctorate Dissertation Award. He is a member of IEEE, ASHRAE TC9.9, ASME, OpenCompute, & iMasons.

Husam Alissa is a Director of Advanced Cooling & Performance in Microsoft’s Cloud Operation & Innovation, Advanced Development Team. His focus areas include systems (chip-server-datacenter), cooling (air, direct to chip, immersion, and cryogenics), performance, architecture, reliability, efficiency, sustainability, and TCO, with more than fifty publications in these fields and multiple patents. His work has received many recognitions including DCD Award for Mission Critical Tech Innovation, IEEE Micro Top Picks, NewYork State Assembly Early Career Achievement, IEEE TCPMT Best Paper Award, ASME InterPACK Outstanding Paper Award, and S3IP Distinguished Doctorate Dissertation Award. He is a member of IEEE, ASHRAE TC9.9, ASME, OpenCompute, & iMasons.

Challenging Moore’s Law
Challenging Moore’s Law
Moore’s law is slowing down, but if performance requirements are to be met, power to chip ratio must be increased....
Read More

Talks from this Speaker

Husam Alissa is a Director of Advanced Cooling & Performance in Microsoft’s Cloud Operation & Innovation, Advanced Development Team. His focus areas include systems (chip-server-datacenter), cooling (air, direct to chip, immersion, and cryogenics), performance, architecture, reliability, efficiency, sustainability, and TCO, with more than fifty publications in these fields and multiple patents. His work has received many recognitions including DCD Award for Mission Critical Tech Innovation, IEEE Micro Top Picks, NewYork State Assembly Early Career Achievement, IEEE TCPMT Best Paper Award, ASME InterPACK Outstanding Paper Award, and S3IP Distinguished Doctorate Dissertation Award. He is a member of IEEE, ASHRAE TC9.9, ASME, OpenCompute, & iMasons.

Challenging Moore’s Law
Challenging Moore’s Law
Moore’s law is slowing down, but if performance requirements are to be met, power to chip ratio must be increased....
Read More

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