Improve HPC performance, by delivering unrivaled IT hardware density while saving up to 95% on cooling cost (corresponding about to 50% of electricity consumption); minimize business disruption during management and operational procedures; lower latency; increase speed deployment with edge ready solutions; enable heat reuse programs for surrounding urban and industrial areas; guarantee zero waste of water; being able to easily/efficiently cool extreme chip densities required for HPC; Submer’s Immersion Cooling technology adapts to any hardware, so there is no need to adapt hardware or cooling solution to the hardware like with Direct Liquid Cooling; immersion-optimized hardware can deliver unprecedented densities
